H. Honjo, K. Nishioka, S. Miura, H. Naganuma, T. Watanabe, T. Nasuno, T. Tanigawa, Y. Noguchi, H. Inoue, M. Yasuhira, et al. 25 nm iPMA-type Hexa-MTJ with solder reflow capability and endurance>107 for eFlash-type MRAM. IEEE International electron devices meeting. 2022. 226-229
Hiroshi Naganuma, Hiroaki Honjo, Chikako Kaneta, Koichi Nishioka, Shoji Ikeda, Tetsuo Endoh. Influence of sidewall damage on thermal stability in quad-CoFeB/MgO interfaces by micromagnetic simulation. AIP Advances. 2022. 12. 000000-1-000000-11
H. Honjo, H. Naganuma, K. Nishioka, T. V. A. Nguyen, M. Yasuhira, S. Ikeda, T. Endoh. Influence of Iridium Sputtering Conditions on the Magnetic Properties of Co/Pt-Based Iridium-Synthetic Antiferromagnetic Coupling Reference Layer. IEEE Transactions on Magnetics. 2022. 58. 8. 1-1
H. Naganuma, S. Miura, H. Honjo, K. Nishioka, T. Watanabe, T. Nasuno, H. Inoue, T. V. A. Nguyen, Y. Endo, Y. Noguchi, et al. Advanced 18 nm Quad-MTJ technology overcomes dilemma of Retention and Endurance under Scaling beyond 2X nm. 2021. 2021-June
K. Nishioka, S. Miura, H. Honjo, H. Naganuma, T.V.A. Nguyen, T. Watanabe, S. Ikeda, T. Emdoh. Effect of Magnetic Coupling Between Two CoFeB Layers on Thermal Stability in Perpendicular Magnetic Tunnel Junctions with MgO/CoFeB/Insertion Layer/CoFeB/MgO Free Layer. IEEE Transactions on Magnetics. 2021. 1-1
H. Sato, H. Honjo, T. Watanabe, M. Niwa, H. Koike, S. Miura, T. Saito, H. Inoue, T. Nasuno, T. Tanigawa, et al. A demonstration of high-performance STT-MRAM by development of unit process and integration process. ICD研究会. 2019
iPMA-type Hexa-MTJ for High Density eFlash-type MRAM
(8th CIES Forum 2023)
25 nm iPMA-type Hexa-MTJ with solder reflow capability and endurance>10^7 for eFlash-type MRAM IEEE International electron devices meeting
(IEDM2022 2022)
Influence of Iridium Sputtering Conditions on the Magnetic Properties of Co/Pt-Based Iridium-Synthetic Antiferromagnetic Coupling Reference Layer
(Joint MMM-Intermag Conference 2022)
Advanced 18 nm Quad-MTJ technology overcomes dilemma of Retention and Endurance under Scaling beyond 2X nm
(VLSI Symposium 2021)
Effect of Magnetic Coupling Between Two CoFeB Layers on Thermal Stability in Perpendicular Magnetic Tunnel Junctions with MgO/CoFeB/Insertion Layer/CoFeB/MgO Free Layer
(IEEE International Magnetic Conference 2021)