研究キーワード (4件)：
ionic conduction Magnetic properties and materials Electric engineering in general Chemical engineering in general
, Metallic composite materials Transport phenomena:diffusion
, イオン伝導 磁性 電子工学一般 化学工学一般
, 金属系複合材料 輸送現象:拡散
競争的資金等の研究課題 (6件)：
極微細配線及び素子の信頼性に関する研究
ULSI高信頼Cu・低誘電率膜多層配線技術
ナノ構造の自己組織形成及びその機能化の研究
Reliability of ULSI interconnections and ultrasmall devices.
Highly Reliable Cu-low-b multilevel interconnecti technology for ULSIs
Formation of nano stractures by self-organization and their applications to nano devices and functional materials.
全件表示
MISC (200件)：
Formation of 10 nm Continuous Cu Film in a Fine Hole by Electroless Plating for Seed Layer Application. Proc. of Advanced Metallization Conference 2003, Mat.Res.Soc.Symp.Proc. 2004. ULSI-XIX. 567
Formation of 10 nm Continuous Cu Film in a Fine Hole by Electroless Plating for Seed Layer Application. Proc. of Advanced Metallization Conference 2003, Mat.Res.Soc.Symp.Proc. 2004. ULSI-XIX. 567
