Yasuda Kiyokazu

ヤスダキヨカズ | Yasuda Kiyokazu

Affiliation and department：
Job title： Associate Professor
Homepage URL (1)： http://www.mapse.eng.osaka-u.ac.jp

Research field (11)： Metals and resources production , Material fabrication and microstructure control , Composite materials and interfaces , Nano/micro-systems , Nanomaterials , Nanobioscience , Nanomaterials , Structural and functional materials , Electronic devices and equipment , Thin-film surfaces and interfaces , Semiconductors, optical and atomic physics

Research keywords (21)： Nanotechnology , Biomimetics , Self-organization , Surface and interface , Electronic devices , Carbon materials , Nanoparticles , Composite materials , Metals , Electronic materials , Ultrasonic , Atmospheric pressure plasma , Laser plasma , Laser , Synchrotron radiation , Surface modification , Laser processing , Welding , Joining , Packaging engineering , Dissimilar materials joining

Research theme for competitive and other funds (17)：

2009 - 2011 Development and Characterization of Self-Restoring Bio-Interface Materials
2008 - 2011 3D Micro Structural and Functional System by Self-Replication
2010 - 2010 Elucidation and emergence of self buildup replication phenomena of micro electronics materials
2010 - 2010 Development of a new method for the formation of self-buildup type micro bumps by the reaction-phase transition cooperative phenomena
2010 - 2010 反応・相転移協同現象による自己集積型微細バンプ形成法の開発

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Papers (261)：

Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa. Design of rose thorn biomimetic micro-protrusion for metals and CFRTP easily disassembled joining. Engineering Research Express. 2024. 6. 2. 025512-025512
Zong-Yu Xie, Po-Kai Huang, Yin-Chi Lu, Golden Kao, Chih-Pin Hung, Kiyokazu Yasuda, Jenn-Ming Song. Microstructural effects of copper deposits on direct bonding for 3D IC integration. Journal of Materials Research and Technology. 2024. 28. 1657-1666
Hyayami Asahara, Kiyokazu Yasuda. Selective Laser Heating for Novel Hybrid Bonding of Three-Dimensional Integrated Circuit. Proc. 33th Microelectronics Symposium. 2023. 243-246
Kiyokazu Yasuda, Yuki Takada, Shungo Kishida, Yinan Zhang, Jenn-Ming Song. Low Temperature Copper Direct Bonding by Laser-Assisted Sintering. Journal of Japan Institute of Copper. 2023. 62. 1. 196-199
Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa. Study on the SPCC and CFRTP Hybrid Joint Performance Produced with Additional Nylon-6 Interlayer by Ultrasonic Plastic Welding. Polymers. 2022. 14. 23. 5235-5235

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MISC (25)：

Modification of surface morphology by high-fluence extreme ultraviolet light. 2016. 16. 70. 1-5
YASUDA Kiyokazu, AMEMORI Norihito, TAKAI Osamu. Analysis of Self-Formation Process in the Hybrid System of Sn-Bi Solder and Silicone Polymer. 2010. 87. 348-349
Micro Bump Formation by Self-Replication Method. Proc. International Conference on Electronics Packaging 2010 (ICEP2010), pp.185-189. 2010. 185-189
Self-Replicating Process for Micro Interconnect Array Pattern Using Solder/Polymer Hybrid Materials. Proc. 60th Electronic Components & Technology Conference 2010 (ECTC2010) pp.1416-1421. 2010. 1416-1421
Process Design of Self-Replication for Micro Bump Formation. Proceedings of IEEE CPMT Symposium Japan (10th VLSI Packaging Workshop in Japan). 2010. 118-121

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Books (3)：

Fortran90/95による実践プログラミング
大阪大学出版会 2014 ISBN:4872594738
最先端メディカルエンジニアリング
名古屋大学メディカルエンジニアリング編集委員会 2013
異種材料一体化のための最新技術~溶接・接着剤・一体成型・加飾~
2012

Lectures and oral presentations (3)：

Ultrasonic Welding of Composites and Surface-structured Metals - Utilization of Chemical and Laser Micro Structuring -
(International Materials Applications & Technologies Conference (IMAT2023), Detroit 2023)
Ultrasonic Joining of Surface-Structured Metals and Reinforced Composites
(International Forum on Welding Technology 2023 (IFWT 2023), Shenzhen 2023)
Nano-Modified Metal Bonding to Advanced Polymers for Automotive Systems
(International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT2018), Oct. 24-26 Taipei 2018)

Education (2)：

1986 - 1988 Osaka University Graduate School of Engineering Faculty of Welding Engineering
1982 - 1986 Osaka University School of Engineering Welding Engineering

Professional career (1)：

Dr. Eng. (Osaka Univeristy)

Work history (8)：

2012/04 - 現在 Osaka University Graduate School of Engineering Associate professor
2020/04 - 2023/03 Tokai National Higher Education and Research System Nagoya University National Composite Center Invited academic fellow
2017/04 - 2020/03 Nagoya University National Composite Center Invited academic fellow
2009/04 - 2012/03 Nagoya University Graduate School of Engineering Associate professor
2005 - 2009 Osaka University Graduate School of Engineering Associate professor

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Awards (7)：

2014/11 - Joining and Welding Research Institute/JWS Best Paper Award of Visual-JW2014
2010/05 - JIEP JIEP Poster Award of ICEP2010
2009/06 - School of Materials & Mineral Resources Engineering (SMMRE) USM Best Poster Award of RAMM & ASMP 2009
2008/09 - JIEP Best Paper Award of MES2007
2006/11 - IEEE CPMT Best Paper Award of IEEE IEMT2006

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Association Membership(s) (11)：

The Carbon Society of Japan , MRS-J (The Materials Research Society of Japan) , Smart Process Society , TMS (The Minerals, Metals & Materials Society) , IEEE EDS (Electron Devices Society) , The Japan Institute of Metals (JIM) , Japan Institute of Electronics Packaging (JIEP) , Japan Laser Processing Society (JLPS) , IEEE EPS (Electronics Packaging Society) , Japan Welding Society (JWS) , The Japan Society of Applied Physics (JSAP)

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