Shingubara Shiyousou

シングウバラシヨウソウ | Shingubara Shiyousou

Affiliation and department：
Job title： Associate Professor,Researcher

Research field (5)： Structural and functional materials , Electric/electronic material engineering , Thin-film surfaces and interfaces , Crystal engineering , Applied materials

Research keywords (4)： ionic conduction Magnetic properties and materials Electric engineering in general Chemical engineering in general , Metallic composite materials Transport phenomena:diffusion , イオン伝導磁性電子工学一般化学工学一般 , 金属系複合材料輸送現象:拡散

Research theme for competitive and other funds (6)：

極微細配線及び素子の信頼性に関する研究
ULSI高信頼Cu・低誘電率膜多層配線技術
ナノ構造の自己組織形成及びその機能化の研究
Reliability of ULSI interconnections and ultrasmall devices.
Highly Reliable Cu-low-b multilevel interconnecti technology for ULSIs

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MISC (200)：

Formation of 10 nm Continuous Cu Film in a Fine Hole by Electroless Plating for Seed Layer Application. Proc. of Advanced Metallization Conference 2003, Mat.Res.Soc.Symp.Proc. 2004. ULSI-XIX. 567
Control of Self-Organization Conditions of Porous Alumina Film Using a Mixture of Oxalic Acid and Sulfuric Acid. Electrochemical and Solid-state Letters. 2004. 7. E15
Formation of 10 nm Continuous Cu Film in a Fine Hole by Electroless Plating for Seed Layer Application. Proc. of Advanced Metallization Conference 2003, Mat.Res.Soc.Symp.Proc. 2004. ULSI-XIX. 567
Control of Self-Organization Conditions of Porous Alumina Film Using a Mixture of Oxalic Acid and Sulfuric Acid. Electrochemical and Solid-state Letters. 2004. 7. E15
ZL Wang, O Yaegashi, H Sakaue, T Takahagi, S Shingubara. Suppression of native oxide growth in sputtered TaN films and its application to Cu electroless plating. JOURNAL OF APPLIED PHYSICS. 2003. 94. 7. 4697-4701

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Patents (12)：

配線形成方法
金属疲労加速試験評価方法
微細配線層を有する半導体装置
インテリジェント抵抗素子
集積回路の配線方法及び集積回路における穴又は溝の埋め込み配線方法並びにマルチチャンバー基板処理装置

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Books (2)：

多層配線技術の最新動向 -銅配線/低誘電率膜-
EDリサーチ社 2002
Recent trend of LSI multilevel interconnection technologies - u and Low-K -
ED research 2002

Works (11)：

半導体の信頼性評価の高精度化の研究浜松ホトニクス
2001 - 2002
高信頼銅・低誘電率膜多層配線技術半導体理工学研究センター
1999 - 2002
無電解Cuめっき技術の研究開発
1999 - 2001
R&Dof electroless Cu plating
1999 - 2001
ホルムアルデヒドフリー無電解銅めっき広島県産業技術推進機構RSP事業
2001 -

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Education (4)：

- 1985 Tokyo Institute of Technology
- 1985 Tokyo Institute of Technology Graduate School, Division of Science
- 1980 The University of Tokyo College of Arts and Sciences
- 1980 The University of Tokyo Faculty of Liberal Arts

Professional career (1)：

理学博士 (東京工業大学)

Work history (4)：

1990 - 2001 Hiroshima University Faculty of Engineering
1990 - 2001 Hiroshima University, Associate Professor
1985 - 1990 東芝ULSI研究所研究員
1985 - 1990 Toshiba ULSI Research Center, Researcher

Committee career (1)：

1996 - 2001 応用物理学会分科会幹事

Awards (1)：

1990 - 国際固体素子材料コンファレンスベストペーパー賞

Association Membership(s) (1)：

応用物理学会

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