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J-GLOBAL ID:200902257726882250   Reference number:03A0698017

Suppression of native oxide growth in sputtered TaN films and its application to Cu electroless plating

スパッタTaN膜における自然酸化物成長の抑制とそのCuの無電解メッキへの応用
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Volume: 94  Issue:Page: 4697-4701  Publication year: Oct. 01, 2003 
JST Material Number: C0266A  ISSN: 0021-8979  CODEN: JAPIAU  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Thin films of other inorganic compounds  ,  Manufacturing technology of solid-state devices 
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