Rchr
J-GLOBAL ID:200901080420817942   Update date: Jul. 16, 2024

Sasagawa Kazuhiko

ササガワ カズヒコ | Sasagawa Kazuhiko
Affiliation and department:
Job title: Professor
Homepage URL  (1): http://www.mech.hirosaki-u.ac.jp/~sasagawa/labhp/
Research field  (7): Electric/electronic material engineering ,  Machine materials and mechanics ,  Nano/micro-systems ,  Nanomaterials ,  Rehabilitation science ,  Biomaterials ,  Biomedical engineering
Research keywords  (13): 電子材料 ,  接触応力センサ ,  材料力学 ,  生体力学 ,  信頼性 ,  機能性 ,  エレクトロマイグレーション ,  接触圧力 ,  材料システム評価学 ,  reliability evaluation ,  functional evaluation ,  electromigration ,  contact pressure
Research theme for competitive and other funds  (41):
  • 2022 - 2027 手術体位による外力と末梢神経への影響の検討
  • 2022 - 2026 Development of evaluation and improvement method for reliability of Ag nanoparticle ink line used in flexible electronic circuits
  • 2019 - 2023 柔らかい電子回路に使う金属ナノ粒子配線の電流・応力下での損傷機構解明と強度評価
  • 2016 - 2018 ENHANCEMENT OF SPATIAL RESOLUTION OF THIN AND FLEXIBLE TACTILE SENSOR AND HIGH FUNCTIONALIZATION OF TOUCH PANEL
  • 2014 - 2017 Suppression and Utilization of Migration Phenomena Based on Control of Passivation for Metallic Thin Film and Micro Ball
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Papers (33):
  • Yuko KUDO, Kazuhiko SASAGAWA, Kazuhiro FUJISAKI. Film sensor for triaxial contact stress measurements on the human body. Mechanical Engineering Letters. 2023. 9. 22-00309
  • Fuki Ota, Kazuhiro Fujisaki, Keita Osanai, Kazuhiko Sasagawa. A novel method for coating calcium phosphate with trace elements extracted from bone using electrical stimulation. Journal of the mechanical behavior of biomedical materials. 2022. 133. 105330-105330
  • Takeshi MORIWAKI, Ryuji TAKAYA, Kazuhiko SASAGAWA, Kazuhiro FUJISAKI. Experimental evaluation of threshold current density for electromigration damage in Al interconnect line with reservoir and sink structure. Mechanical Engineering Letters. 2022. 8. 22-00035
  • Keita OSANAI, Kazuhiro FUJISAKI, Fuki OTA, Kazuhiko SASAGAWA, Takeshi MORIWAKI. Demineralization characteristics of cortical bone under voltage application in phosphate-buffered saline. Journal of Biomechanical Science and Engineering. 2022. 17. 2. 21-00293
  • Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki. Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current. Journal of Electronic Packaging. 2021
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MISC (366):
Patents (8):
  • センサ装置および分布測定装置
  • 接触圧力測定システム
  • METAL INTERCONNECT RELIABILITY EVALUATION DEVICE, METHOD THEREOF, AND RECORDING MEDIUM STORING PROGRAM FOR EVALUATING RELIABILITY OF METAL INTERCONNECT(特願平11-111478号)
  • 多層構造配線のEM損傷によるしきい電流密度予測システム(特願2004-100093号)
  • 金属配線の信頼性評価装置及び方法, 並びに金属配線の信頼性評価のためのプログラムを格納した記録媒体(特願平11-111478号)
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Books (8):
  • Metallic Micro and Nano Materials - Fabrication with Atomic Diffusion
    Springer 2011
  • Metallic Micro and Nano Materials - Fabrication with Atomic Diffusion
    Springer 2011
  • Mechanism and Provision for Migration in Metal Lines
    Science & Technology 2006
  • Handbook of Experimental Techniques and Tequnical Terms
    The Japanese Society for Experimental Mechanics 2006
  • Mechanism and Provision for Migration in Metal Lines
    Science & Technology 2006
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Works (4):
  • 損傷膝半月板置換のための人工半月板開発の基礎研究
    2002 -
  • Development of Artificial Knee Meuiscus
    2002 -
  • LSIの断線予測法の開発
    1999 -
  • Development of prediction method for metal line failure in LSI
    1999 -
Education (4):
  • - 1993 Niigata University
  • - 1993 Niigata University Graduate School, Division of National Science and Technology
  • - 1988 Niigata University Faculty of Engineering
  • - 1988 Niigata University Faculty of Engineering Department of Mechanical Engineering
Professional career (2):
  • Doctor of Engineering
  • Master of Engineering
Work history (6):
  • 1993 - 1999 Tohoku University
  • 1993 - 1999 Tohoku University, Research Associate and Assistant Professor
  • 1991 - 1991 ミネソタ大学ヘネピンカウンティメディカルセンター
  • 1991 - 1991 Minnesota Univ., Hennepin County Medical Center,
  • 生体力学研究所 研究員
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Awards (12):
  • 2007 - InterPACK’07 Outstanding Paper Award(The Electronic and Photonic Packaging Division of The American Society of Mechanical Engineers)
  • 2007 - InterPACK’07 Outstanding Paper Award(The Electronic and Photonic Packaging Division of The American Society of Mechanical Engineers)
  • 2002 - 原田研究奨励賞
  • 2002 - インテリジェント・コスモス奨励賞
  • 2002 - Harada Encourage Award
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Association Membership(s) (6):
米国実験力学会 ,  日本材料学会 ,  バイオメカニズム学会 ,  日本生体医工学会 ,  日本臨床バイオメカニクス学会 ,  日本機械学会
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