Art
J-GLOBAL ID：200902026962303839   Reference number：91A0146331

Viscoelastic properties of resin for IC plastic packages and the residual stress.

ICパッケージ用樹脂の粘弾性特性と残留応力
Author (2)：
KAWADA HIROSHI

About KAWADA HIROSHI

(東京工大 大学院)

About 東京工大 大学院

, 
IKEGAMI KOZO

About IKEGAMI KOZO

(東京工大 精密工研)

About 東京工大 精密工研


Material：
日本機械学会論文集 A編  (Transactions of the Japan Society of Mechanical Engineers. Series A)

About 日本機械学会論文集 A編


Volume： 56  Issue： 532  Page： 2471-2478  Publication year： Dec. 1990 
JST Material Number： F0227B  ISSN： 0387-5008  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
integrated circuit

About integrated circuit

,...
   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=91A0146331&from=J-GLOBAL&jstjournalNo=F0227B") }}
JST classification (2)：
JST classification
Category name(code) classified by JST.
General 
(NC03161C)

About General

,  Electric insulating materials 
(YH06020F)

About Electric insulating materials

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
ICパッケージ

About ICパッケージ

, 
粘弾性特性

About 粘弾性特性

, 
残留応力

About 残留応力


Return to Previous Page

TOP

BOTTOM