Art
J-GLOBAL ID：200902027608934046   Reference number：91A0399976

Thermal cycling induced plastic deformation in solder joints. Part I. Accumulated deformation in surface mount joints.

熱サイクルにより発生するはんだ接合部分の可塑性変形 1 表面実装接合における蓄積された変形
Author (1)：
PAN T-Y

About PAN T-Y

(Ford Motor Co., Mich.)

About Ford Motor Co., Mich.


Material：
Journal of Electronic Packaging  (Transactions of the ASME. Journal of Electronic Packaging)

About Journal of Electronic Packaging


Volume： 113  Issue： 1  Page： 8-15  Publication year： Mar. 1991 
JST Material Number： T0929A  ISSN： 1043-7398  CODEN： JEPAE4  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
soldering

About soldering

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
STM

About STM


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JST classification (2)：
JST classification
Category name(code) classified by JST.
Connecting parts 
(NA05050Z)

About Connecting parts

,  Brazing 
(WC07050C)

About Brazing

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
熱サイクル

About 熱サイクル

, 
はんだ接合部

About はんだ接合部

, 
塑性変形

About 塑性変形

, 
表面実装

About 表面実装

, 
蓄積

About 蓄積


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