Art
J-GLOBAL ID：200902032404744764   Reference number：88A0414124

Isothermal fatigue of low tin lead based solder.

低すずの鉛基はんだの恒温疲れ
Author (3)：
VAYNMAN S

About VAYNMAN S

(Northwestern Univ., IL, USA)

About Northwestern Univ., IL, USA

, 
FINE M E

About FINE M E

(Northwestern Univ., IL, USA)

About Northwestern Univ., IL, USA

, 
JEANNOTTE D A

About JEANNOTTE D A

(IBM Corp., NY, USA)

About IBM Corp., NY, USA


Material：
Metallurgical Transactions. A. Physical Metallurgy and Materials Science  (Metall Trans A)

About Metallurgical Transactions. A. Physical Metallurgy and Materials Science


Volume： 19  Issue： 4  Page： 1051-1059  Publication year： Apr. 1988 
JST Material Number： E0265B  ISSN： 0360-2133  CODEN： MTTABN  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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solder

About solder

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Mechanical properties 
(WB02030U)

About Mechanical properties

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
すず

About すず

, 
鉛

About 鉛

, 
はんだ

About はんだ


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