Art
J-GLOBAL ID：200902041447908476   Reference number：87A0354693

Solder joint fatigue in surface mount technology : State of the art.

表面実装技術におけるはんだ結合部の疲労 技術の現況
Author (2)：
LAU J H

About LAU J H

(Hewlett-Packard Lab., CA, USA)

About Hewlett-Packard Lab., CA, USA

, 
RICE D W

About RICE D W

(Hewlett-Packard Lab., CA, USA)

About Hewlett-Packard Lab., CA, USA


Material：
Solid State Technology  (Solid State Technol)

About Solid State Technology


Volume： 28  Issue： 10  Page： 91-104  Publication year： Oct. 1985 
JST Material Number： E0226A  ISSN： 0038-111X  Document type： Article
Article type： 解説  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
high density packaging

About high density packaging

,...
   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=87A0354693&from=J-GLOBAL&jstjournalNo=E0226A") }}
JST classification (2)：
JST classification
Category name(code) classified by JST.
Connecting parts 
(NA05050Z)

About Connecting parts

,  Brazing 
(WC07050C)

About Brazing

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
表面実装技術

About 表面実装技術

, 
はんだ

About はんだ

, 
疲労

About 疲労


Return to Previous Page

TOP

BOTTOM