Art
J-GLOBAL ID：200902065729670509   Reference number：91A0443196

Silicon-on-insulator by wafer bonding: A review.

ウエハボンディングによるシリコン-オン-インシュレータ 総説
Author (1)：
MASZARA W P

About MASZARA W P

(Allied-Signal Aerospace Co., Maryland)

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Material：
Journal of the Electrochemical Society  (J Electrochem Soc)

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Volume： 138  Issue： 1  Page： 341-347  Publication year： Jan. 1991 
JST Material Number： C0285A  ISSN： 1945-7111  CODEN： JESOAN  Document type： Article
Article type： 解説  Country of issue： United States (USA)  Language： ENGLISH (EN)
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wafer

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,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
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All keywords is available on JDreamIII(charged).
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ウエハ薄化技術

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JST classification (1)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

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Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
ウエハボンディング

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, 
シリコン

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, 
インシュレータ

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, 
総説

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