Art
J-GLOBAL ID：200902074035142229   Reference number：89A0136328

Initiation of electroless copper plating using Pd+2/poly(acrylic acid) films.

Pd2+/ポリアクリル酸膜を用いる無電解銅めっきの開始
Author (1)：
JACKSON R L

About JACKSON R L

(IBM Almaden Research Center, CA, USA)

About IBM Almaden Research Center, CA, USA


Material：
Journal of the Electrochemical Society  (J Electrochem Soc)

About Journal of the Electrochemical Society


Volume： 135  Issue： 12  Page： 3172-3173  Publication year： Dec. 1988 
JST Material Number： C0285A  ISSN： 1945-7111  CODEN： JESOAN  Document type： Article
Article type： 短報  Country of issue： United States (USA)  Language： ENGLISH (EN)
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printed wiring

About printed wiring

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JST classification (1)：
JST classification
Category name(code) classified by JST.
Electroless plating 
(WC08024S)

About Electroless plating

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
ポリアクリル酸

About ポリアクリル酸

, 
電解

About 電解

, 
銅めっき

About 銅めっき


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