Art
J-GLOBAL ID：200902101329467816
Reference number：02A0439489
Stress relaxation of wood during elevating and lowering processes of temperature and the set after relaxation II: Consideration of the mechanism and simulation of stress relaxation behavior using a viscoelastic model.
温度の上昇過程,降下過程における木材の応力緩和および緩和後のセット II 粘弾性モデルを用いた応力緩和挙動の機構およびシミュレーションの考察
Author (5)：
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Material：
Volume：
48
Issue：
2
Page：
119-125
Publication year：
Apr. 25, 2002
JST Material Number：
L3386A
ISSN：
1435-0211
Document type：
Article
Article type：
原著論文
Country of issue：
Germany, Federal Republic of (DEU)
Language：
ENGLISH (EN)
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Nature and structure of wood(=timber)
Reference (10)：
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IIDA, I. Stress relaxation of wood in the elevating and lowering processes of temperature and the set after relaxation. J Wood Sci. 2002, 48, 8-13
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KITAHARA, K. The influence of the change of temperature on creep in bending. Mokuzai Gakkaishi. 1964, 10, 169-175
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ARIMA, T. Creep in process of temperature changes. I. Creep in process of constant elevated and decreased temperature. Mokuzai Gakkaishi. 1972, 18, 349-353
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SHNIEWIND, A. On the influence of moisture content changes on the creep of beech wood perpendicular to the grain including the effects of temperature and temperature changes. Holz Roh Werkstoff. 1966, 24, 87-98
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ISHIMARU, Y. Dynamic viscoelastiy properties of wood in various stages of swelling. Mokuzai Gakkaishi. 1996, 42, 205-257
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Terms in the title
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