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J-GLOBAL ID：200902101879614212   Reference number：95A0870866

Modeling and Analysis of Substrate Coupling in Integrated Circuits.

集積回路における基板結合のモデル化と解析
Author (2)：
GHARPUREY R

About GHARPUREY R

(Univ. California at Berkeley)

About Univ. California at Berkeley

, 
MEYER R G

About MEYER R G

(Univ. California at Berkeley)

About Univ. California at Berkeley


Material：
Proceedings of the IEEE Custom Integrated Circuits Conference  (IEEE Custom Integrated Circuits Conference)

About Proceedings of the IEEE Custom Integrated Circuits Conference


Volume： 1995  Page： 125-128  Publication year： 1995 
JST Material Number： H0843A  ISSN： 0886-5930  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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substrate (plate)

About substrate (plate)

,...
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General 
(NC03161C)

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Terms in the title (3)：
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集積回路

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, 
モデル化

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, 
解析

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