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J-GLOBAL ID：200902101879614212   Reference number：95A0870866

Modeling and Analysis of Substrate Coupling in Integrated Circuits.

集積回路における基板結合のモデル化と解析
Author (2)：
GHARPUREY R

About GHARPUREY R

(Univ. California at Berkeley)

About Univ. California at Berkeley

, 
MEYER R G

About MEYER R G

(Univ. California at Berkeley)

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Material：
Proceedings of the IEEE Custom Integrated Circuits Conference  (IEEE Custom Integrated Circuits Conference)

About Proceedings of the IEEE Custom Integrated Circuits Conference


Volume： 1995  Page： 125-128  Publication year： 1995 
JST Material Number： H0843A  ISSN： 0886-5930  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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substrate(plate)

About substrate(plate)

,...
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General 
(NC03161C)

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Terms in the title (3)：
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集積回路

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, 
モデル化

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, 
解析

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