Encapsulation of Ag films on SiO<sub>2</sub> by Ti reactions using Ag-Ti alloy/bilayer structures and an NH<sub>3</sub> ambient.

ALFORD T L; ADAMS D; LAURSEN T; ULLRICH B M

Art

J-GLOBAL ID：200902119472537147 Reference number：96A0555495

Encapsulation of Ag films on SiO₂ by Ti reactions using Ag-Ti alloy/bilayer structures and an NH₃ ambient.

Ag-Ti合金/2層構造とNH₃雰囲気を用いたTi反応によるSiO₂上のAg膜のカプセル封じ

Publisher site Copy service {{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=96A0555495&COPY=1") }}
Access JDreamⅢ for advanced search and analysis. {{ this.onShowJLink("http://jdream3.com/lp/jglobal/index.html?docNo=96A0555495&from=J-GLOBAL&jstjournalNo=H0613A") }}

Author (4)： , , ,
Material：
Volume： 68 Issue： 23 Page： 3251-3253 Publication year： Jun. 03, 1996
JST Material Number： H0613A ISSN： 0003-6951 CODEN： APPLAB Document type： Article
Article type：短報 Country of issue： United States (USA) Language： ENGLISH (EN)

,...

To see more with JDream III (charged). {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=96A0555495&from=J-GLOBAL&jstjournalNo=H0613A") }}

Metallic thin films

, , , , , , ,

Return to Previous Page

Encapsulation of Ag films on SiO2 by Ti reactions using Ag-Ti alloy/bilayer structures and an NH3 ambient.

Encapsulation of Ag films on SiO₂ by Ti reactions using Ag-Ti alloy/bilayer structures and an NH₃ ambient.