Art
J-GLOBAL ID：200902119691369179   Reference number：98A0992238

Damascene copper electroplating for chip interconnections.

チップ内部結線のためのダマシンCuめっき
Author (5)：
ANDRICACOS P C

About ANDRICACOS P C

(IBM Res. Div., New York)

About IBM Res. Div., New York

, 
UZOH C

About UZOH C

(IBM Microelectronics Div., New York)

About IBM Microelectronics Div., New York

, 
DUKOVIC J O

About DUKOVIC J O

(IBM Res. Div., New York)

About IBM Res. Div., New York

, 
HORKANS J

About HORKANS J

(IBM Res. Div., New York)

About IBM Res. Div., New York

, 
DELIGIANNI H

About DELIGIANNI H

(IBM Res. Div., New York)

About IBM Res. Div., New York


Material：
IBM Journal of Research and Development  (IBM J Res Dev)

About IBM Journal of Research and Development


Volume： 42  Issue： 5  Page： 567-574  Publication year： Sep. 1998 
JST Material Number： D0061B  ISSN： 0018-8646  CODEN： IBMJAE  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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*integrated circuit

About integrated circuit

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

About Manufacturing technology of solid-state devices

,  Electroplating 
(WC08023B)

About Electroplating

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
結線

About 結線

, 
ダマシン

About ダマシン

, 
Cuめっき

About Cuめっき


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