Art
J-GLOBAL ID：200902121451650746   Reference number：00A0159573

An Inertial Sensor Technology Using DRIE and Wafer Bonding with Interconnecting Capability.

相互接続機能によるDRIEとウエハ結合を使った慣性センサ技術
Author (4)：
ISHIHARA K

About ISHIHARA K

(Massachusetts Inst. Technol., MA, USA)

About Massachusetts Inst. Technol., MA, USA

, 
YUNG C-F

About YUNG C-F

(Massachusetts Inst. Technol., MA, USA)

About Massachusetts Inst. Technol., MA, USA

, 
AYON A A

About AYON A A

(Massachusetts Inst. Technol., MA, USA)

About Massachusetts Inst. Technol., MA, USA

, 
SCHMIDT M A

About SCHMIDT M A

(Massachusetts Inst. Technol., MA, USA)

About Massachusetts Inst. Technol., MA, USA


Material：
Journal of Microelectromechanical Systems  (J Microelectromechanical Syst)

About Journal of Microelectromechanical Systems


Volume： 8  Issue： 4  Page： 403-408  Publication year： Dec. 1999 
JST Material Number： W0357A  ISSN： 1057-7157  CODEN： JMIYET  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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*inertia

About inertia

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Measurement of geometric and mechanical quantities in general 
(AD05010D)

About Measurement of geometric and mechanical quantities in general

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
相互接続

About 相互接続

, 
DRIE

About DRIE

, 
ウエハ

About ウエハ

, 
慣性センサ

About 慣性センサ


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