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J-GLOBAL ID:200902121451650746   Reference number:00A0159573

An Inertial Sensor Technology Using DRIE and Wafer Bonding with Interconnecting Capability.

相互接続機能によるDRIEとウエハ結合を使った慣性センサ技術
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Volume:Issue:Page: 403-408  Publication year: Dec. 1999 
JST Material Number: W0357A  ISSN: 1057-7157  CODEN: JMIYET  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Measurement of geometric and mechanical quantities in general 
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