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J-GLOBAL ID:200902133005525774   Reference number:02A0889388

Radiation Mechanism of Via-interconnections with Power-geound Plane of Multi-layer PCB.

多層プリント板の電源系プレーンに接続されるビア配線による不要ふく射発生メカニズム
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Volume: J85-B  Issue: 11  Page: 1981-1984  Publication year: Nov. 01, 2002 
JST Material Number: S0622C  ISSN: 1344-4697  Document type: Article
Article type: 短報  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Printed circuits  ,  Noise in general 
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