Art
J-GLOBAL ID：200902140764114580
Reference number：97A0501334
Smart-Cut: A New Silicon On Insulator Material Technology Based on Hydrogen Implantation and Wafer Bonding.
スマートカット 水素注入とウエハ貼合せに基づいた新しいシリコンオン絶縁体技術
-
Publisher site
Copy service
{{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=97A0501334©=1") }}
-
Access JDreamⅢ for advanced search and analysis.
{{ this.onShowJLink("http://jdream3.com/lp/jglobal/index.html?docNo=97A0501334&from=J-GLOBAL&jstjournalNo=G0520B") }}
Author (3)：
,
,
Material：
Volume：
36
Issue：
3B
Page：
1636-1641
Publication year：
Mar. 1997
JST Material Number：
G0520B
ISSN：
0021-4922
Document type：
Article
Article type：
原著論文
Country of issue：
Japan (JPN)
Language：
ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
,...
JST classification (1)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices
Reference (19)：
-
1) A. J. Auberton-Hervé, J. M. Lamure, T. Barge, M. Bruel, B. Aspar and J. L. Pelloie: Semicond. Int. 11 (1995) 97.
-
2) J. P. Colinge: Proc. Int. Electron. Device Meet. (1994) p. 817.
-
3) J. B. Lasky: Appl. Phys. Lett. 48 (1986) 78
-
4) W. P. Maszara: Proc. Fourth Int. Symp. on Silicon on Insulator Technology and Devices, ed. D. N. Schmidt, Vol. 90-6, The Electrochem. Soc. Series, Pennington (1990) p. 199.
-
5) P. M. Mumola, G. J. Gardopee, P. J. Clapis, C. B. Zarowin, L. D. Bolliger and A. M. Ledger: Proc. 1992 IEEE Int. SOI Conf., Florida (1992) p. 152.
ｍore...
Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
,
,
,
,
Return to Previous Page
