Art
J-GLOBAL ID：200902146430775525   Reference number：97A0829967

Measurement of mixed mode fracture toughness of an interface crack in electronic devices.

電子デバイスの界面亀裂の混合モード破壊靭性の測定
Author (3)：
IKEDA T

About IKEDA T

(Kyushu Univ., Fukuoka, JPN)

About Kyushu Univ., Fukuoka, JPN

, 
KOMOHARA Y

About KOMOHARA Y

(Kyushu Univ., Fukuoka, JPN)

About Kyushu Univ., Fukuoka, JPN

, 
MIYAZAKI N

About MIYAZAKI N

(Kyushu Univ., Fukuoka, JPN)

About Kyushu Univ., Fukuoka, JPN


Material：
ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)  (ASME EEP (Am Soc Mech Eng Electr Electron Packag Div.))

About ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)


Volume： 19  Issue： Volume 2  Page： 1437-1444  Publication year： 1997 
JST Material Number： W0624A  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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IC package

About IC package

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
strain relaxation

About strain relaxation


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JST classification (3)：
JST classification
Category name(code) classified by JST.
Rubber and plastic materials 
(HC04030W)

About Rubber and plastic materials

,  Metallic materials 
(HC04020L)

About Metallic materials

,  Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
電子デバイス

About 電子デバイス

, 
界面亀裂

About 界面亀裂

, 
混合モード

About 混合モード

, 
破壊靭性

About 破壊靭性


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