Art
J-GLOBAL ID：200902149499861430
Reference number：96A0983153
Low resistivity Al-RE (RE=La,Pr, and Nd) alloy thin films with high thermal stability for thin-film-transistor interconnects.
薄膜トランジスタ配線用の高い熱安定性をもつ低抵抗Al-RE(RE=La,Pr,Nd)合金薄膜
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Author (2)：
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Material：
Volume：
14
Issue：
5
Page：
3257-3262
Publication year：
Sep. 1996
JST Material Number：
E0974A
ISSN：
1071-1023
CODEN：
JVTBD9
Document type：
Article
Article type：
原著論文
Country of issue：
United States (USA)
Language：
ENGLISH (EN)
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices
, Metallic thin films
Terms in the title (8)：
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