Mechanism of polishing of SiO<sub>2</sub> films by CeO<sub>2</sub> particles.

HOSHINO T; KURATA Y; TERASAKI Y; SUSA K

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J-GLOBAL ID：200902154982919389 Reference number：01A0670476

Mechanism of polishing of SiO₂ films by CeO₂ particles.

SiO₂膜のCeO₂粒子による研磨の機構

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Author (4)： , , ,
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Volume： 283 Issue： 1/3 Page： 129-136 Publication year： May. 2001
JST Material Number： D0642A ISSN： 0022-3093 Document type： Article
Article type：原著論文 Country of issue： Netherlands (NLD) Language： ENGLISH (EN)

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Surface structure of solids in general , Grinding

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Mechanism of polishing of SiO2 films by CeO2 particles.

Mechanism of polishing of SiO₂ films by CeO₂ particles.