Mechanism of polishing of SiO<sub>2</sub> films by CeO<sub>2</sub> particles.

HOSHINO T; KURATA Y; TERASAKI Y; SUSA K

Art

J-GLOBAL ID：200902154982919389 Reference number：01A0670476

Mechanism of polishing of SiO₂ films by CeO₂ particles.

SiO₂膜のCeO₂粒子による研磨の機構

Publisher site Copy service {{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=01A0670476&COPY=1") }}
Access JDreamⅢ for advanced search and analysis. {{ this.onShowJLink("http://jdream3.com/lp/jglobal/index.html?docNo=01A0670476&from=J-GLOBAL&jstjournalNo=D0642A") }}

Author (4)： , , ,
Material：
Volume： 283 Issue： 1/3 Page： 129-136 Publication year： May. 2001
JST Material Number： D0642A ISSN： 0022-3093 Document type： Article
Article type：原著論文 Country of issue： Netherlands (NLD) Language： ENGLISH (EN)

,...

To see more with JDream III (charged). {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=01A0670476&from=J-GLOBAL&jstjournalNo=D0642A") }}

Surface structure of solids in general , Grinding

Return to Previous Page

Mechanism of polishing of SiO2 films by CeO2 particles.

Mechanism of polishing of SiO₂ films by CeO₂ particles.