Art

J-GLOBAL ID：200902155415145492   Reference number：98A0180327

Experimental Verification of High Frequency Conduction Characteristics of Terminal Connections by Conductive Adhesive Materials.

導電接着材による端子接続の高周波導通特性の実験的検証

Author (4)： OTSUKA KANJI (明星大 情報) ,  WATANABE ITSUO (日立化成工業) ,  WADA MINORU (Epoxy Technology Inc., MA, USA) ,  ESTES R H (Epoxy Technology Inc., MA, USA)
Material： 回路実装学会誌  (Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits)
Volume： 13  Issue： 1  Page： 37-43  Publication year： Jan. 1998 
JST Material Number： X0497A  ISSN： 1341-0571  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： high density packaging ,...
Semi thesaurus term： パルススイッチング ,...

   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=98A0180327&from=J-GLOBAL&jstjournalNo=X0497A") }}

JST classification (1)： Manufacturing technology of solid-state devices  (NC03030V)

Reference (11)：

• WATANABE, I. Flip-Chip Interconnection to Various Substrates Using Anisotropic Conductive Adhesive Film. Journal of Electronics Manufacturing. 1995, 5, 4, 273-276
• KUSAGAYA, K. Flip Chip Mounting Using Stud Bumps and Adhesives for Enchapsulation. Proceedings of International Conference on Multichip Modules. 1993, 587-595
• VIERTL, B. Flip Chip with Polymer Bumps on Various Substrates. Proceedings of First International Conference on Adhesives in Electronics, Berlin. 1994
• OTSUKA, K. High Frequency Characterization of Conductive Adhesive and Its Interconnection Technology. Proceedings of Adhesive in Electronics '96. 1996, 114-125
• OTSUKA, K. High Frequency Characterization of Conductive Adhesive. Extended Abstract of Third VLSI Packaging Workshop of Japan. 1996, 87-91

Terms in the title (5)： 接着材 ,  高周波 ,  導通 ,  実験 ,  検証