Art
J-GLOBAL ID:200902157136171915   Reference number:01A0769634

Mechanical behavior and thermal stability of nanocrystalline copper film prepared by gas deposition method.

ガス堆積法により調製したナノ結晶銅膜の機械的挙動及び熱安定性
Author (3):
Material:
Volume: 44  Issue: 8/9  Page: 1547-1551  Publication year: May. 18, 2001 
JST Material Number: B0915A  ISSN: 1359-6462  Document type: Article
Article type: 原著論文  Country of issue: United Kingdom (GBR)  Language: ENGLISH (EN)
Thesaurus term:
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
,...
   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=01A0769634&from=J-GLOBAL&jstjournalNo=B0915A") }}
JST classification (2):
JST classification
Category name(code) classified by JST.
Mechanical properties  ,  Metallic thin films 
Terms in the title (6):
Terms in the title
Keywords automatically extracted from the title.

Return to Previous Page