Art
J-GLOBAL ID：200902167369915219   Reference number：00A0945340

Chip scale package issues.

チップスケールパッケージの問題点
Author (1)：
GHAFFARIAN R

About GHAFFARIAN R

(California Inst. Technol., CA, USA)

About California Inst. Technol., CA, USA


Material：
Microelectronics Reliability  (Microelectronics and Reliability)

About Microelectronics Reliability


Volume： 40  Issue： 7  Page： 1157-1161  Publication year： Jul. 2000 
JST Material Number： C0530A  ISSN： 0026-2714  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)
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*IC package

About IC package

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
BGA【パッケージ】

About BGA【パッケージ】


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JST classification (2)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

,  Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (2)：
Terms in the title
Keywords automatically extracted from the title.
チップスケールパッケージ

About チップスケールパッケージ

, 
問題点

About 問題点


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