Novel Sputtering Process to Reduce the Grain Size and Its Distribution in Co-Based Longitudinal Thin Film Media. New Seedlayer and High K<sub>u</sub><sup>Grain</sup> Material.

TAKAHASHI M; SHOJI H; DJAYAPRAWIRA D D; YOSHIMURA S

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J-GLOBAL ID：200902176922470750 Reference number：01A0546816

Novel Sputtering Process to Reduce the Grain Size and Its Distribution in Co-Based Longitudinal Thin Film Media. New Seedlayer and High K_u^Grain Material.

Coベースの長手薄膜媒体の粒子サイズとその分布を減少させる新しいスパッタリング過程新しいシード層と高K_u^Grain材料

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Volume： 36 Issue： 5,Pt.1 Page： 2315-2320 Publication year： Sep. 2000
JST Material Number： A0339B ISSN： 0018-9464 CODEN： IEMGAQ Document type： Article
Article type：原著論文 Country of issue： United States (USA) Language： ENGLISH (EN)

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Novel Sputtering Process to Reduce the Grain Size and Its Distribution in Co-Based Longitudinal Thin Film Media. New Seedlayer and High KuGrain Material.

Novel Sputtering Process to Reduce the Grain Size and Its Distribution in Co-Based Longitudinal Thin Film Media. New Seedlayer and High K_u^Grain Material.