Art
J-GLOBAL ID：200902179010752770   Reference number：97A0829976

Reliability modeling for ball grid array assembly with a large number of warpage affected solder joints.

はんだ継手に影響を及ぼす大きな反りを持つボールグリッドアレイの信頼性のモデル化
Author (6)：
CHAN Y W

About CHAN Y W

(Univ. Colorado, Colorado)

About Univ. Colorado, Colorado

, 
JU T H

About JU T H

(Univ. Colorado, Colorado)

About Univ. Colorado, Colorado

, 
HAREB S A

About HAREB S A

(Univ. Colorado, Colorado)

About Univ. Colorado, Colorado

, 
LEE Y C

About LEE Y C

(Univ. Colorado, Colorado)

About Univ. Colorado, Colorado

, 
WU J-S

About WU J-S

(Semi-Custom Design and Manufacturing, Colorado)

About Semi-Custom Design and Manufacturing, Colorado

, 
LII M-J

About LII M-J

(Intel Corp., Arizona)

About Intel Corp., Arizona


Material：
ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)  (ASME EEP (Am Soc Mech Eng Electr Electron Packag Div.))

About ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)


Volume： 19  Issue： Volume 2  Page： 1507-1514  Publication year： 1997 
JST Material Number： W0624A  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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soldering

About soldering

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
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All keywords is available on JDreamIII(charged).
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thermal fatigue

About thermal fatigue

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Brazing 
(WC07050C)

About Brazing

,  Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
はんだ継手

About はんだ継手

, 
反り

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, 
ボールグリッドアレイ

About ボールグリッドアレイ

, 
モデル化

About モデル化


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