Art

J-GLOBAL ID：200902185693700754   Reference number：02A0274383

Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy.

低温系Sn-Bi-Cu鉛フリーはんだの機械的特性および接合信頼性

Author (4)： TAKAO HISAAKI (豊田中研) ,  YAMADA AKIRA (豊田中研) ,  HASEGAWA HIDEO (豊田中研) ,  MATSUI MASAO (豊田中研)
Material： エレクトロニクス実装学会誌  (Journal of Japan Institute of Electronics Packaging)
Volume： 5  Issue： 2  Page： 152-158  Publication year： Mar. 01, 2002 
JST Material Number： S0579C  ISSN： 1343-9677  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： *solder ,...
Semi thesaurus term： 鉛フリーはんだ

   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=02A0274383&from=J-GLOBAL&jstjournalNo=S0579C") }}

JST classification (1)： Connecting parts  (NA05050Z)

Reference (14)：

• Proposal for a Directive on Waste Electrical and Electronic Equipment (WEEE) and Proposal for a Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (ROHS). COM(2000)347 final, Commission of the European Communities. 2000, 79
• Texts adopted at the sitting of Tuesday 15May 2001. 2001, 49
• http://www.lead-free.org/legislation/detail/ec-weee-current-status.html
• 竹本正. Sn-Ag-Bi系Pbフリーソルダの引張変形挙動. 溶接学会論文集. 1998, 16, 1, 87-92
• VINCENT, J. H. Lead-Free Solders for Electronic Assembly. GEC J. Res. 1994, 11, 2, 6-89

Terms in the title (6)： 低温 ,  Sn ,  Bi ,  Cu ,  鉛フリーはんだ ,  機械的特性