Art
J-GLOBAL ID：200902186201829923   Reference number：96A0444213

DV multiple substrate for high-density packaging and its development technology.

高密度実装対応DVマルチ基板と開発技術
Author (1)：
OTA HIRONORI

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(NEC富山)

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Material：
表面実装技術  (Surface Mount Technology)

About 表面実装技術


Volume： 6  Issue： 5  Page： 12-15  Publication year： May. 1996 
JST Material Number： L2473A  ISSN： 0917-5156  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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printed board

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,...
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JST classification (1)：
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Printed circuits 
(NA05040O)

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Terms in the title (3)：
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高密度実装

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, 
マルチ

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, 
開発

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