Art
J-GLOBAL ID：200902188326967328   Reference number：02A0618566

Three-Diemensional X-Ray Laminography as a Tool for Detection and Characterization of BGA Package Defects.

BGAパッケージ欠陥の検出および特性評価のためのツールとしての三次元X線断層撮影法
Author (3)：
MOORE T D

About MOORE T D

(Analog Devices BV, Limerick, IRL)

About Analog Devices BV, Limerick, IRL

, 
VANDERSTRAETEN D

About VANDERSTRAETEN D

(Alcatel Microelectronics, Oudenaarde, BEL)

About Alcatel Microelectronics, Oudenaarde, BEL

, 
FORSSELL P M

About FORSSELL P M

(Nokia Mobile Phones, Ltd., Salo, FIN)

About Nokia Mobile Phones, Ltd., Salo, FIN


Material：
IEEE Transactions on Components and Packaging Technologies  (IEEE Trans Compon Packag Technol)

About IEEE Transactions on Components and Packaging Technologies


Volume： 25  Issue： 2  Page： 224-229  Publication year： Jun. 2002 
JST Material Number： H0255C  ISSN： 1521-3331  CODEN： ITCPFB  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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*X-ray computed tomography

About X-ray computed tomography

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
BGA【パッケージ】

About BGA【パッケージ】

,...
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JST classification (3)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

,  X-ray instruments and techniques 
(BA02060D)

About X-ray instruments and techniques

,  Nondestructive testing 
(HB02030F)

About Nondestructive testing

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
BGAパッケージ

About BGAパッケージ

, 
欠陥

About 欠陥

, 
特性評価

About 特性評価

, 
ツール

About ツール

, 
X線断層撮影法

About X線断層撮影法


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