Art
J-GLOBAL ID：200902189705252553   Reference number：97A0249307

Design of experiment based evaluation of the thermal performance of a flipchip electronic assembly.

Author (1)：
MITHAL P

About MITHAL P

(Delco Electronics Corp., Indiana, USA)

About Delco Electronics Corp., Indiana, USA


Material：
ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)  (ASME EEP (Am Soc Mech Eng Electr Electron Packag Div.))

About ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)


Volume： 18  Page： 109-115  Publication year： 1996 
JST Material Number： W0624A  Document type： Article
Country of issue： United States (USA)  Language： ENGLISH (EN)
Terms in the title (1)：
Terms in the title
Keywords automatically extracted from the title.
DESIGN

About DESIGN


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