Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. Build-up Structure Pinted Circuit Board.

TSUKADA YUTAKA

Art

J-GLOBAL ID：200902197621233769 Reference number：94A0724071

Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. Build-up Structure Pinted Circuit Board.

特集 MCM/LSI実装技術 MCM/LSI実装用プリント配線板製造プロセスビルドアップ法プリント配線板

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Author (1)：
Material：
Volume： 9 Issue： 5 Page： 364-368 Publication year： Aug. 1994
JST Material Number： X0497A ISSN： 0914-8299 Document type： Article
Article type：解説 Country of issue： Japan (JPN) Language： JAPANESE (JA)

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Hydrid integrated circuit , Printed circuits

Reference (3)：

1) Y.Tsukada, S.Tsuchida, Y.Mashimoto: “Surface Laminar Circuit Packaging”, Proceeding 42nd Electronic Components & Technology Conference, SanDiego CA., pp.22-27 (1992)
2) Y.Tsukada, Y.Mashimoto, T.Nishio, N.Mii: “Reliability and Stress Analysis of Encapsulated Flip Chip Joint of Epoxy Base Printed Circuit Board”, Proceedings of ASME/JSME Joint Conference on Electronic Packaging, Vol.2, pp.827-835 (1992)
3) Y.Tsukada, Y.Maeda, K.Yamanaka: “A Novel Solution for MCM-L Utilizing Surface Laminar Circuit and Flip Chip Attach Technology”, Proceedings of 2nd International Conference and Exhibition on Multichip Modules, Denver CO., pp.252-259 (1993)

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