Thermal Fatigue Behavior of J-Lead Solder Joints.

SCHMIDT C G; SIMONS J W; KANAZAWA C H; ERLICH D C

Art

J-GLOBAL ID：200902197972920762 Reference number：95A0923712

Thermal Fatigue Behavior of J-Lead Solder Joints.

J鉛はんだ接合部の熱疲労挙動

Publisher site Copy service {{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=95A0923712&COPY=1") }}
Access JDreamⅢ for advanced search and analysis. {{ this.onShowJLink("http://jdream3.com/lp/jglobal/index.html?docNo=95A0923712&from=J-GLOBAL&jstjournalNo=H0255C") }}

Author (4)： , , ,
Material：
Volume： 18 Issue： 3 Page： 611-617 Publication year： Sep. 1995
JST Material Number： H0255C ISSN： 1070-9886 Document type： Article
Article type：原著論文 Country of issue： United States (USA) Language： ENGLISH (EN)

,...

To see more with JDream III (charged). {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=95A0923712&from=J-GLOBAL&jstjournalNo=H0255C") }}

Connecting parts

, ,

Return to Previous Page