Art
J-GLOBAL ID：200902198661079394
Reference number：95A0035219
Analysis of Package Cracking During Reflow Soldering Process. Quantification and Improvement of Adhesion Strength of Interface.
表面実装時のパッケージクラック解析 内部界面の改善とその強度
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Author (4)：
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Material：
Volume：
94
Issue：
361(ICD94 147-159)
Page：
73-80
Publication year：
Nov. 25, 1994
JST Material Number：
S0532B
ISSN：
0913-5685
Document type：
Proceedings
Article type：
原著論文
Country of issue：
Japan (JPN)
Language：
JAPANESE (JA)
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices
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