Art
J-GLOBAL ID：200902207199310939   Reference number：06A0081205

High Performance Polymers for Electronics Package Material

先端半導体を支える高分子 実装材料の最新動向
Author (2)：
TAKAHASHI AKIO

About TAKAHASHI AKIO

(日立 基礎研)

About 日立 基礎研

, 
KAKIMOTO MASAAKI

About KAKIMOTO MASAAKI

(東京工大 大学院理工学研究科)

About 東京工大 大学院理工学研究科


Material：
高分子  (Polymers)

About 高分子


Volume： 55  Issue： 2  Page： 86-89  Publication year： Feb. 01, 2006 
JST Material Number： F0168A  ISSN： 0454-1138  CODEN： KOBUA3  Document type： Article
Article type： 文献レビュー  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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*LSI

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,...
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heat conduction

About heat conduction


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JST classification (2)：
JST classification
Category name(code) classified by JST.
Physical properties of polymer solids in general 
(CG02021V)

About Physical properties of polymer solids in general

,  Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

Reference (11)：
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Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
高分子

About 高分子

, 
実装

About 実装

, 
最新動向

About 最新動向


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