Art
J-GLOBAL ID：200902209164698147   Reference number：03A0473374

Hygroscopic Swelling and Sorption Characteristics of Epoxy Molding Compounds Used in Electronic Packaging

半導体素子パッケージングに使用されるエポキシモールディングコンパウンドの吸湿膨張および吸着特性
Author (3)：
ARDEBILI H

About ARDEBILI H

(General Electric, NY, USA)

About General Electric, NY, USA

, 
WONG E H

About WONG E H

(Inst. Microelectronics, SGP)

About Inst. Microelectronics, SGP

, 
PECHT M

About PECHT M

(Univ. Maryland, MD, USA)

About Univ. Maryland, MD, USA


Material：
IEEE Transactions on Components and Packaging Technologies  (IEEE Trans Compon Packag Technol)

About IEEE Transactions on Components and Packaging Technologies


Volume： 26  Issue： 1  Page： 206-214  Publication year： Mar. 2003 
JST Material Number： H0255C  ISSN： 1521-3331  CODEN： ITCPFB  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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*IC package

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,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
accelerated test

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,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

,  Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
半導体素子パッケージング

About 半導体素子パッケージング

, 
吸湿

About 吸湿

, 
膨張

About 膨張

, 
吸着特性

About 吸着特性


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