Art
J-GLOBAL ID：200902240143219332   Reference number：03A0316272

Present problems of power module packaging technology.

パワーモジュールの実装技術の現状の問題
Author (1)：
SHAMMAS N Y A

About SHAMMAS N Y A

(Staffordshire Univ., Stafford, GBR)

About Staffordshire Univ., Stafford, GBR


Material：
Microelectronics Reliability  (Microelectronics and Reliability)

About Microelectronics Reliability


Volume： 43  Issue： 4  Page： 519-527  Publication year： Apr. 2003 
JST Material Number： C0530A  ISSN： 0026-2714  Document type： Article
Article type： 短報  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)
Thesaurus term：
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All keywords is available on JDreamIII(charged).
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*power transistor

About power transistor

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Hydrid integrated circuit 
(NC03163K)

About Hydrid integrated circuit

,  Transistors 
(NC03070N)

About Transistors

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
パワーモジュール

About パワーモジュール

, 
実装

About 実装

, 
現状

About 現状


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