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J-GLOBAL ID:200902241561933048   Reference number:06A0421072

Fabrication of High-Mobility Nitrided Hafnium Silicate Gate Dielectrics with Sub-1-nm Equivalent Oxide Thickness Using Plasma Nitridation and High-Temperature Postnitridation Annealing

プラズマ窒化法および高温窒化後アニーリングを用いた,サブナノメータの等価酸化厚さを有する高移動度窒化けい酸ハフニウムゲート誘電体の作製
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Material:
Volume: 45  Issue: 4B  Page: 2898-2902  Publication year: Apr. 30, 2006 
JST Material Number: G0520B  ISSN: 0021-4922  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: ENGLISH (EN)
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Applications of plasma  ,  Oxide thin films  ,  Electric conduction in other inorganic compounds 
Reference (13):
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  • S. Inumiya, K. Sekine, S. Niwa, A. Kaneko, M. Sato, T. Watanabe, H. Fukui, Y. Kamata, M. Koyama, A. Nishiyama, M. Takayanagi, K. Eguchi and Y. Tsunashima: 2003 Symp. VLSI Technology, 2003, p. 18.
  • K. Sekine, S. Inumiya, M. Sato, A. Kaneko, K. Eguchi and Y. Tsunashima: IEDM Tech. Dig., 2003, p. 103.
  • The International Technology Roadmap for Semiconductors, Semiconductor Industry Association, 2004.
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