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J-GLOBAL ID:200902252704878614   Reference number:06A0102335

Inspection of Internal Bonding Wire of Semiconductor Integrated Circuit by Image Processing

画像処理による半導体集積回路内部ボンディングワイヤ検査
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Volume: 70  Issue:Page: 230-235  Publication year: Feb. 05, 2004 
JST Material Number: F0268A  ISSN: 0912-0289  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Measurement,testing and reliability of solid-state devices  ,  Pattern recognition 
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