Art
J-GLOBAL ID：200902259574633279   Reference number：03A0062455

The effect of slurry viscosity on chemical-mechanical polishing of silicon wafers.

シリコンウエハの化学機械的研磨に及ぼすスラリー粘度の影響
Author (2)：
MULLANY B

About MULLANY B

(Univ. Coll. Dublin, Dublin, IRL)

About Univ. Coll. Dublin, Dublin, IRL

, 
BYRNE G

About BYRNE G

(Univ. Coll. Dublin, Dublin, IRL)

About Univ. Coll. Dublin, Dublin, IRL


Material：
Journal of Materials Processing Technology  (J Mater Process Technol)

About Journal of Materials Processing Technology


Volume： 132  Issue： 1/3  Page： 28-34  Publication year： Jan. 10, 2003 
JST Material Number： H0650A  ISSN： 0924-0136  Document type： Article
Article type： 原著論文  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)
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*wafer

About wafer

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
化学機械的研磨

About 化学機械的研磨

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

About Manufacturing technology of solid-state devices

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
シリコンウエハ

About シリコンウエハ

, 
化学機械的研磨

About 化学機械的研磨

, 
スラリー

About スラリー

, 
粘度

About 粘度


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