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J-GLOBAL ID:200902259574633279   Reference number:03A0062455

The effect of slurry viscosity on chemical-mechanical polishing of silicon wafers.

シリコンウエハの化学機械的研磨に及ぼすスラリー粘度の影響
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Volume: 132  Issue: 1/3  Page: 28-34  Publication year: Jan. 10, 2003 
JST Material Number: H0650A  ISSN: 0924-0136  Document type: Article
Article type: 原著論文  Country of issue: Netherlands (NLD)  Language: ENGLISH (EN)
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Manufacturing technology of solid-state devices 
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