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J-GLOBAL ID:200902263706654863   Reference number:08A0860487

Diffusion Bonding of Co to TiAu High Temperature Shape Memory Alloy

TiAu高温形状記憶合金へのCoの拡散接合
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Volume: 49  Issue:Page: 1998-2005 (J-STAGE)  Publication year: 2008 
JST Material Number: G0668A  ISSN: 1345-9678  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: ENGLISH (EN)
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Bonding 
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