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Volume:
56
Issue:
3
Page:
302-308
Publication year:
Mar. 15, 2007
JST Material Number:
F0385A
ISSN:
0514-5163
CODEN:
ZARYA
Document type:
Article
Article type:
解説
Country of issue:
Japan (JPN)
Language:
JAPANESE (JA)
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JST classification
Category name(code) classified by JST.
4) JSMS Committee on High Temperature Strength of Materials, “JSMS Report Inelastic Constitutive Model for Solders” The Society of Materials Science, Japan (2004).
5) Y. Tsukada, “An Experimental Study of Creep-Fatigue for Sn-37Pb in Flip Chip Bonding” Doctoral Thesis, Ritsumeikan University, p.39 (2005).