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J-GLOBAL ID:200902279178597074   Reference number:07A0087645

Study on Structure Transformation of Si Wafer in Grinding Process

研削工程でのSiウエハにおける構造転移
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Volume: 329  Page: 373-378  Publication year: 2006 
JST Material Number: D0744C  ISSN: 1013-9826  Document type: Article
Article type: 原著論文  Country of issue: Switzerland (CHE)  Language: ENGLISH (EN)
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Manufacturing technology of solid-state devices  ,  Structure of amorphous semiconductors 
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