Art
J-GLOBAL ID：200902283776481444   Reference number：05A0546507

Formation of Ti Diffusion Barrier Layers in Thin Cu(Ti) Alloy Films

Cu(Ti)合金薄膜内のTi拡散障壁層形成
Author (5)：
TSUKIMOTO S.

About TSUKIMOTO S.

(Kyoto Univ., Kyoto, JPN)

About Kyoto Univ., Kyoto, JPN

, 
MORITA T.

About MORITA T.

(Kyoto Univ., Kyoto, JPN)

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, 
MORIYAMA M.

About MORIYAMA M.

(Toyoda Gosei Co., Ltd., Aichi, JPN)

About Toyoda Gosei Co., Ltd., Aichi, JPN

, 
ITO Kazuhiro

About ITO Kazuhiro

(Kyoto Univ., Kyoto, JPN)

About Kyoto Univ., Kyoto, JPN

, 
MURAKAMI Masanori

About MURAKAMI Masanori

(Kyoto Univ., Kyoto, JPN)

About Kyoto Univ., Kyoto, JPN


Material：
Journal of Electronic Materials  (J Electron Mater)

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Volume： 34  Issue： 5  Page： 592-599  Publication year： May. 2005 
JST Material Number： D0277B  ISSN： 0361-5235  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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copper base alloy

About copper base alloy

,...
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JST classification (1)：
JST classification
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Manufacturing technology of solid-state devices 
(NC03030V)

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Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
Cu

About Cu

, 
Ti

About Ti

, 
合金薄膜

About 合金薄膜

, 
拡散障壁

About 拡散障壁

, 
層形成

About 層形成


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