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J-GLOBAL ID:200902283776481444   Reference number:05A0546507

Formation of Ti Diffusion Barrier Layers in Thin Cu(Ti) Alloy Films

Cu(Ti)合金薄膜内のTi拡散障壁層形成
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Volume: 34  Issue:Page: 592-599  Publication year: May. 2005 
JST Material Number: D0277B  ISSN: 0361-5235  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Manufacturing technology of solid-state devices 
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