Art

J-GLOBAL ID：200902285951742011   Reference number：08A0032340

Cyclic Stress Measurement Method Using Grain Size of Grown Grains in Electrodeposited Copper Foil

電着銅薄膜に発生する成長粒子の結晶粒径に着目した繰返し応力測定法

Author (2)： ONO YUICHI (鳥取大 工) ,  KITAOKA SEIICHIRO (鳥取大 工)
Material： 日本機械学会論文集 A編  (Transactions of the Japan Society of Mechanical Engineers. Series A)
Volume： 73  Issue： 736  Page： 1417-1423  Publication year： Dec. 25, 2007 
JST Material Number： F0227B  ISSN： 0387-5008  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： electrodeposition coating ,...
Semi thesaurus term： electrodeposited coating

   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=08A0032340&from=J-GLOBAL&jstjournalNo=F0227B") }}

JST classification (3)： Metallic materials  (HC02020X) ,  Nondestructive testing  (HB02030F) ,  Metallic thin films  (BK14030T)

Reference (9)：

• OHKUBO, H. Copper Electroplating Method of Stress Analysis. Memoirs Fac. Eng. Nagoya Univ. 1968, 20, 1, 1
• KITAOKA, S. Measurement of Biaxial Stress Using Grown Grain Density Rate in Electrodeposited Copper Foil with a Microcircular Hole. Transactions of the Japan Society of Mechanical Engineers, Series A. 2003, 69, 679, 565-570
• KATO, A. Basic Research of Copper Electoroplating Stress Measurement Method. Transactions of the Japan Society of Mechanical Engineers, Series A. 1983, 49, 446, 1344-1349
• NAGAOKA, K. Material Science for Mechanical Engineering. 1968, 125
• RALPH, I. S. Metal Fatigue in Engineering. 2001, 434

Terms in the title (7)： 電着 ,  銅薄膜 ,  成長 ,  結晶粒径 ,  着目 ,  繰返し応力 ,  測定法