Measurement of Biaxial Stress Using Grown Grain Density Rate in Electrodeposited Copper Foil with a Microcircular Hole.

KITAOKA SEIICHIRO; ONO YUICHI; NAKAGAWA MASAAKI

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J-GLOBAL ID：200902298836444133 Reference number：03A0227108

Measurement of Biaxial Stress Using Grown Grain Density Rate in Electrodeposited Copper Foil with a Microcircular Hole.

微小円孔を有する電着銅薄膜の成長粒子発生密度を利用した二軸応力検出法

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Material：
Volume： 69 Issue： 679 Page： 565-570 Publication year： Mar. 25, 2003
JST Material Number： F0227B ISSN： 0387-5008 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： JAPANESE (JA)

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Metallic materials , Electroforming

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