Art
J-GLOBAL ID：200902287648943201   Reference number：06A0025709

Temperature control of electromigration to form gold nanogap junctions

金ナノギャップ接合を形成するエレクトロマイグレーションの温度制御
Author (2)：
ESEN G.

About ESEN G.

(Dep. of Physics and Center for Superconductivity Res., Univ. of Maryland, Coll. Park, Maryland 20742-4111)

About Dep. of Physics and Center for Superconductivity Res., Univ. of Maryland, Coll. Park, Maryland 20742-4111

, 
FUHRER M. S.

About FUHRER M. S.

(Dep. of Physics and Center for Superconductivity Res., Univ. of Maryland, Coll. Park, Maryland 20742-4111)

About Dep. of Physics and Center for Superconductivity Res., Univ. of Maryland, Coll. Park, Maryland 20742-4111


Material：
Applied Physics Letters  (Appl Phys Lett)

About Applied Physics Letters


Volume： 87  Issue： 26  Page： 263101-263101-3  Publication year： Dec. 26, 2005 
JST Material Number： H0613A  ISSN： 0003-6951  CODEN： APPLAB  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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All keywords is available on JDreamIII(charged).
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Gold

About Gold

,...
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JST classification (1)：
JST classification
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Diffusion in metals 
(BL06022C)

About Diffusion in metals

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
金

About 金

, 
ギャップ接合

About ギャップ接合

, 
エレクトロマイグレーション

About エレクトロマイグレーション

, 
温度制御

About 温度制御


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