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J-GLOBAL ID:200902291343544371   Reference number:03A0106026

Grounding Resistance and Grounding Impedance of Horizontal Bundled Conductor Grounding Electrodes.

多導体を用いた水平接地極の接地抵抗と接地インピーダンス
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Material:
Volume: 123  Issue:Page: 54-59  Publication year: Jan. 01, 2003 
JST Material Number: S0809A  ISSN: 0385-4213  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Grounding 
Reference (8):
  • (1) 例えば,電気設備工事技術研究協会編 : 接地工事設計施工マニュアル(第2版),p.21,オーム社(1979)
  • (2) T. Takashima, et al.:"Calculation of Grounding Resistance of Mesh Electrode by the Current Simulation Method Using Average Potential on Contour Surface", T. IEE Japan , Vol.105-B, No.1, pp.62-68 (1985-1) (in Japanese)
    高嶋・大坪・石橋・河村: s面上の平均電位を用いた電流源重畳法による接地網の接地抵抗の計算C電学論B,105,1,p.62(1985-1)
  • (3) 例えば、電気学会 : 送配電工学(青カバー),p.109,電気学会(2000)
  • (4) A. Ohtsubo, et al.:"A Method of Images for Using Vector Potentials and Application to Computation of Grounding Electrode Inductance", T. IEE Japan , Vol.119-A, No.12, pp.1421-1428 (1999-12) (in Japanese)
    大坪・櫻野・北崎・高嶋: xクトルボテンシャルを用いるための影像法と接地極インダクタンス計算への適用C電学論A,119,12,pp.1421-1428(1999-12)
  • (5) B. R. Gupta & B. Thaper : "Impulse Impedance of Grounding Systems", IEEE PES Summer Meeting Paper A 78563-9 (1978)
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