Fatigue Crack Propagation in Surface Film-Bonded Materials Using Pure Copper and Commercial Grade Iron Films

TORII T; MATSUBA A

Art

J-GLOBAL ID：200902292158400360 Reference number：04A0554345

Fatigue Crack Propagation in Surface Film-Bonded Materials Using Pure Copper and Commercial Grade Iron Films

純銅膜および工業用純鉄膜を用いた表面膜接着材料の疲労き裂伝搬

Publisher site Copy service {{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=04A0554345&COPY=1") }}
Access JDreamⅢ for advanced search and analysis. {{ this.onShowJLink("http://jdream3.com/lp/jglobal/index.html?docNo=04A0554345&from=J-GLOBAL&jstjournalNo=G0026B") }}

Author (2)： ,
Material：
Volume： 47 Issue： 3 Page： 389-396 Publication year： Jul. 15, 2004
JST Material Number： G0026B ISSN： 1344-7912 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： ENGLISH (EN)

,...

To see more with JDream III (charged). {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=04A0554345&from=J-GLOBAL&jstjournalNo=G0026B") }}

Metallic materials , Material testing

Reference (13)：

(1) Sato, E., Ikezoe, Y. and Kato, J., Metal Core Copper Clad Laminates, Hitachi Chemical Technical Report, (in Japanese), Vol.8 (1987), pp.15-18.
(2) Ikegami, K., Some Topics of Mechanical Problems in Electronic Packaging, Advances in Electronic Packaging, ASME, Vol.1 (1992), pp.567-573.
(3) Ohori, M., Sato, C. and Ikegami, K., Viscoelastic Properties and Internal Stress of Thermosetting Resin in Curing Process, J. Soc. Mater. Sci., Jpn., (in Japanese), Vol.43, No.484 (1994), pp.18-22.
(4) Scholand, A.J., Fulton, R.E. and Bras, B., An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life, Trans. ASME, J. Electron. Packag., Vol.121, No.1 (1999), pp.31-36.
(5) Yu, Q. and Shiratori, M., Fatigue-Strength Prediction of Microelectronics Solder Joints under Thermal Cyclic Loading, IEEE Trans. Comp., Packag. Manufact. Technol., A, Vol.20, No.3 (1997), pp.266-273.

ｍore...

, , , , ,

Return to Previous Page