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J-GLOBAL ID:201102214302045151   Reference number:11A0825838

Fabrication of Au Microstructure Using ICP-RIE

ICPエッチングによる微細構造体を用いた金構造体の作製
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Volume: 77  Issue: 775  Page: 691-697 (WEB ONLY)  Publication year: 2011 
JST Material Number: U0184A  ISSN: 1884-8354  Document type: Article
Article type: 短報  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Manufacturing technology of solid-state devices 
Reference (11):
  • (1) Becker, E. W, Ehrfeld, W., Hagmann, P., Maner, A. and Munchmeyer D., “Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)”, Microelectronic. Engineering, Vol. 4, No. 1 (1986), pp. 35-56.
  • (2) Hirata, Y., “LIGA process - micromachining technique using synchrotron radiation lithography - and some industrial applications”, Nuclear Instruments and Methods in Physics Research Section B, Vol. 208 (2003), pp. 21-26.
  • (3) Malek, C.K. and Saile, V., “Applications of LIGA technology to Precision manufacturing of high-aspect-ratio micro-components and -systems”, Microelectronics Journal, Vol. 35, No. 2 (2004), pp. 131-143.
  • (4) Bischofberger, R., Zimmermann, H. and Staufert, G., “Low-cost MARMS process”, Sensors and Actuators A, Vol. 61, No. 1-3 (1997), pp. 392-399.
  • (5) Malek, C.K., “SU8 resist for low-cost X-ray patterning of high-resolution, high-aspect-ratio MEMS”, Microelectronics Journal, Vol. 33, No. 1-2 (2002), pp. 101-105.
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